Semiconductor device and production thereof

ABSTRACT

A semiconductor device containing a polycrystalline silicon thin film wherein crystal grains of the silicon thin film have mainly a columnar structure and a crystal orientation of individual crystal grains is almost in a uniform direction can be produced by depositing a non-impurity-doped silicon thin film or an impurity layer on an interface of underlying film, followed by deposition of impurity-doped silicon thin film, if necessary, followed by heat treatment for polycrystallization.

This application is a Continuation application of application Ser. No.08/880,445, filed Jun. 24, 1997 now U.S. Pat. No. 6,080,611, which is aDivisional application of application Ser. No. 08/527,942, filed Sep.14, 1995 now U.S. Pat. No. 5,670,793.

BACKGROUND OF THE INVENTION

This invention relates to a semiconductor device prevented from changesof internal stress in a silicon thin film and generation of crystaldefects caused by the changes of internal stress, and processes forproducing the same, as well as to processes for producing a silicon thinfilm and a chemical vapor deposition apparatus suitable for forming sucha silicon thin film.

In the production of semiconductor devices, a silicon thin film is usedas electrodes and/or a wiring material. Since the silicon thin film is asemiconductor material, it is necessary to reduce electric resistancewhen used as a wiring material. In general, it is doped with an elementof group III or V (e.g. B, P, As, etc.) by diffusion. In the doping withsuch an impurity, there has been employed thermal diffusion from filmsurface or ion implantation.

Recently, since the structure of semiconductor devices is complicated, alevel difference of surfaces on which the thin film is to be depositedis made as small as possible in order to improve evenness of depositionof the thin film. Thus, there is a tendency to reduce the film thicknessof various thin films including a silicon thin film. When the filmthickness is reduced, there arise problems such as contamination of anunderlying film with a dopant, concentration and uneven deposition of adopant near the interface of underlying film, and the like, when thethermal diffusion from film surface or the ion implantation is employed.In order to solve such problems, an in-situ doping technique wherein animpurity is doped simultaneously at the time of deposition of a siliconthin film is proposed and used for producing products.

As processes for depositing a silicon thin film, there are known aprocess which comprises depositing silicon in an amorphous state,followed by polycrystallization by heat treatment, and a process fordepositing in a polycrystalline state from the beginning. Generallyspeaking, since there is a tendency to enlarge crystal grain size in thecase of deposition in an amorphous state, followed bypolycrystallization by heat treatment, it is preferable to form apolycrystalline silicon film by this process in order to attain lowelectric resistance of the thin film. Therefore, there is widely used aprocess for forming a polycrystalline silicon film comprising depositingamorphous silicon doped with an impurity simultaneously, followed bypolycrystallization by heat treatment. Such a technique is disclosed,for example, in Japanese Patent Unexamined Publication No. (JP-A)62-54423 and 4-137724.

But, according to such a technique, there are following problems. Whenan amorphous (including a fine crystalline state) silicon thin film iscrystallized by heat treatment, it is generally known that crystalnucleuses are grown from the interface between the silicon thin film andthe underlying film. Therefore, the state of crystal growth is oftenchanged (by, for example, generating density and generating temperatureof crystal nucleuses, crystal grain size, or growing crystal planeindices) depending on an impurity concentration or its distribution inthe amorphous silicon film near the interface of underlying film.

Further, at the time of crystallization reaction, since the volume ofthin film is changed, the internal stress state in the film is alsochanged greatly. Further, the direction of stress (i.e. tensile strengthor compression stress) generated at the time of crystallization isgreatly changed by growing crystal state. As a result, there arisevarious problems in that generated internal stress in the silicon thinfilm becomes greater, or in a wafer on which the thin film is deposited,the internal stress in the thin film and growing crystal planes aredifferentiated, the degree of concentration of stress generated near endportions of the thin film and the crystal state are also differentiated,crystal defects such as dislocation are generated in a silicon singlecrystal substrate, electrical properties of a semiconductor device aredifferentiated in a wafer including a silicon single crystal, etc.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a semiconductordevice improved in reliability overcoming the defects as mentioned aboveand processes for producing such a semiconductor device in a high yield.

It is another object of the present invention to provide processes forproducing a polycrystalline silicon thin film on an optional substrateand a chemical vapor deposition apparatus for forming such a siliconthin film.

The present invention provides a semiconductor device comprising asemiconductor substrate, an underlying film formed thereon and a siliconthin film doped with an impurity selected from group III and V elementsand formed on the underlying film, crystal grains of said silicon thinfilm having mainly a columnar structure grown from an interface of theunderlying film to a surface of the silicon thin film, and a crystalorientation on film surfaces of individual crystal grains being in analmost uniform direction.

The present invention also provides a process for producing asemiconductor device, which comprises forming an underlying film on asemiconductor substrate, and forming a silicon thin film on theunderlying film by depositing a silicon film having no impurity from aSiH₄ gas or a Si₂H₆ gas to a thickness of 1 nm or more, followed bydeposition of the silicon film doped with an impurity selected fromgroup III and V elements. When an amorphous silicon thin film isdeposited, heat treatment is conducted to finally provide apolycrystalline silicon thin film.

The present invention further provides a process for producing asemiconductor device, which comprises forming an underlying film on asemiconductor substrate, forming an impurity layer from an impurity gasselected from group III and V elements, said impurity layer having ahigher concentration of impurity than an average impurity concentrationin a silicon thin film to be formed on an interface of underlying film,and depositing a silicon film from a SiH₄ gas or a Si₂H₆ gas doped withthe impurity. When an amorphous silicon thin film is deposited, heattreatment is conducted to finally provide a polycrystalline silicon thinfilm.

The present invention still further provides a process for producing asilicon thin film, which comprises introducing into a reaction chamber araw material gas selected from SiH₄ gas and Si₂H₆ gas to deposit asilicon film having no impurity to a thickness of 1 nm or more, followedby introduction of an impurity gas selected from group III and Velements together with the raw material gas to deposit a silicon filmdoped with the impurity. When an amorphous silicon thin film isdeposited, heat treatment is conducted to finally provide apolycrystalline silicon thin film.

The present invention also provides a process for producing a siliconthin film, which comprises introducing into a reaction chamber animpurity gas selected from group III and V elements to form an impuritylayer having a higher concentration than an average impurityconcentration in a silicon thin film to be formed on an interface ofunderlying film, and introducing a raw material gas selected from SiH₄gas and Si₂H₆ gas together with the impurity gas to deposit a siliconthin film doped with the impurity. When an amorphous silicon thin filmis deposited, heat treatment is conducted to finally provide-apolycrystalline silicon thin film.

The present invention further provide a chemical vapor depositionapparatus for forming a silicon thin film comprising

a reaction chamber,

a gas introducing unit for introducing a raw material gas and animpurity gas into the reaction chamber,

a unit for controlling film deposition in the reaction chamber, and

a gas exhaust unit for exhausting gases from the reaction chamber,

said unit for controlling film deposition being made either

(i) so as to introduce the impurity gas selected from group III and Velements together with the raw material gas after the introduction ofonly the raw material gas selected from SiH₄ gas and Si₂H₆ gas for apredetermined time, or

(ii) so as to introduce only the impurity gas selected from group IIIand IV elements for a predetermined time before the introduction of theraw material gas selected from SiH₄ gas and Si₂H₆ gas together with theimpurity gas.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of one example of the semiconductordevice immediately after the film deposition according to the presentinvention.

FIG. 2 is a cross-sectional view of the same example of thesemiconductor device after heat treatment according to the presentinvention.

FIG. 3 is an electron microscope photograph showing the structure ofgrowing crystal at a cross-section of P-doped amorphous silicon thinfilm.

FIG. 4 is an electron microscope photograph showing the structure ofgrowing crystal at a plane of P-doped amorphous silicon thin film.

FIG. 5 is an electron microscope photograph showing the structure ofgrowing crystal at a cross-section of P-doped amorphous silicon thinfilm when the non-doped layer is formed.

FIG. 6 is an electron microscope photograph showing the structure ofgrowing crystal at a plate of P-doped amorphous silicon thin film whenthe non-doped layer is formed.

FIG. 7 is a flow chart explaining one example of the process fordepositing the thin film.

FIG. 8 is a flow chart explaining another example of the process fordepositing the thin film.

FIG. 9 is a cross-sectional view of another example of the semiconductordevice immediately after the film deposition according to the presentinvention.

FIG. 10 is a cross-sectional view of the same example of thesemiconductor device after heat treatment according to the presentinvention.

FIG. 11 is a cross-sectional view of a further example of thesemiconductor device immediately after the film deposition according tothe present invention.

FIG. 12 is a cross-sectional view of a transistor according to thepresent invention.

FIG. 13 is a cross-sectional view of a still further example of thesemiconductor device immediately after the film deposition according tothe present invention.

FIG. 14 is a cross-sectional view of one example of the semiconductordevice according to the present invention.

FIG. 15 is a cross-sectional view of a gate electrode according to thepresent invention.

FIG. 16 is a cross-sectional view of a flash memory according to thepresent invention.

FIG. 17 is a schematic view of a chemical vapor deposition apparatusaccording to the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

In order to solve the problems of the prior art, the present inventorsfound that the impurity concentration and its distribution (ordifferences in the concentration) near the interface between theamorphous (including fine crystalline state) silicon thin film and theunderlying film (e.g. silicon dioxide film) is controlled so as to makethe state for generating crystal nucleuses almost uniform and to makethe crystal state (crystal grain size and crystal orientation) ofpolycrystalline film after heat treatment stable (or uniform).

Further, in order to control the impurity concentration and itsdistribution near the interface of underlying film, the presentinventors found that it is effective to form either a layer notcontaining an impurity near the interface of underlying film (i.e. onthe underlying film), or a layer containing the impurity in a remarkablyhigh concentration near the interface of underlying film (i.e. on theunderlying film). By employing such a method, the direction of crystalplane of polycrystalline layer after crystallization becomes almostuniform, so that the above-mentioned object can be attained due tostabilization of crystal state.

The semiconductor device according to the present invention comprises asemiconductor substrate, an underlying film formed thereon and apolycrystalline silicon thin film doped with an impurity selected fromgroup III and V elements and formed on the underlying film, crystalgrains of said silicon thin film having mainly a columnar structuregrown from an interface of the underlying film to a surface of thesilicon thin film, and a crystal orientation on film surfaces ofindividual crystal grains being in an almost uniform direction.

As the semiconductor substrate, there can be used conventional ones suchas a silicon single crystal substrate, a so-called SOI(silicon-on-insulator) substrate, a wafer obtained by epitaxial growth,and the like. As the underlying film, there can be used films of SiO₂,SiN, N₂O (oxynitride), Ta₂O₅, ferroelectric metals of PZT (complex ofoxides of Pb, Zr and Ti), or a laminate structure thereof. As theimpurity, there can be used an element selected from group III and Velements such as P (phosphorus), B (boron), As (arsenic), etc. singly oras a mixture thereof. Further, the expression “in an almost uniformdirection” means that crystal graphic direction of polycrystallinegrains is the same in 60% or more, preferably 80% or more, morepreferably 90% or more.

In the case of providing a metal-oxide-silicon (MOS) field-effecttransistor, a gate oxide film is used as the underlying film and a gateelectrode is made from a polycrystalline silicon thin film. That is, thesemiconductor device comprises a silicon single crystal substrate, agate oxide film and a gate electrode formed on the gate oxide film, saidgate electrode being made from a silicon thin film doped with animpurity selected from group III and V elements, said silicon thin filmbeing deposited on the gate oxide film, crystal gains of said siliconthin film having mainly a columnar structure grown from an interface ofthe gate oxide film to a surface of the silicon thin film, and a crystalorientation of film surfaces of individual crystal grains being in analmost uniform direction.

Such a semiconductor device can be produced by forming an underlyingfilm on a semiconductor substrate using a conventional method, andforming a silicon thin film on the underlying film by depositing asilicon film having no impurity from a raw material gas such as a SiH₄gas or a Si₂H₆ gas to a thickness of 1 nm or more, followed bydeposition of the silicon film doped with an impurity selected fromgroup III and V elements, followed by heat treatment at 550° C. to 1000°C. when the deposited silicon film is an amorphous silicon film to givea polycrystalline silicon thin film.

Alternatively, such a semiconductor device can be produced by forming anunderlying film on a semiconductor substrate using a conventionalmethod, and forming a silicon thin film on the underlying film byforming an impurity layer from an impurity gas selected from group IIIand V elements, said impurity layer having a higher concentration ofimpurity than an average impurity concentration in a silicon thin filmto be formed on an interface of underlying film and depositing a siliconfilm from a raw material gas such as a SiH₄ gas or a Si₂H₆ gas dopedwith the impurity, followed by heat treatment at 550° C. to 1000° C.when the deposited silicon film is an amorphous silicon film to give apolycrystalline silicon thin film.

The deposition of silicon thin film is carried out at 500° C. to 700° C.in the case of polycrystalline silicon thin film, or at 500° C. to 600°C. in the case of amorphous silicon thin film.

The average concentration of impurity in the thin film is about10¹⁸-10²¹ number of atom per cm³, and the silicon concentration in thethin film is about 5×10²² number of atom per cm³.

As mentioned above, (i) by depositing a silicon thin film containing noimpurity first to a thickness for making the crystal growth moreuniform, followed by deposition of a silicon thin film doped with animpurity, or (ii) by depositing an impurity layer having a higherconcentration of impurity than an average impurity concentration in asilicon thin film to be formed on an interface of underlying film,followed by deposition of a silicon thin film doped with the impurity,the semiconductor device having improved reliability can be produced ina high yield overcoming the prior art problems.

Observation of crystal structure in the course of crystallization at across-section of the film is explained below referring topolycrystallization of amorphous silicon thin film by heat treatment.The amorphous silicon thin film is formed, for example, on a thermaloxide film of silicon (as an underlying film) in about 100 nm thick. Apart of amorphous state is found to be crystallized.

It is admitted in the polycrystallized film that individual crystalgrains begin to grow near the interface of underlying film and growcolumnarly to the surface of the thin film. In other words, the crystalnucleuses of individual crystal grains are generated near the interfacebetween the thin film and the underlying film. But it should be notedthat there are two kinds of plane shapes of crystal grains, whenobserved from the surface direction of the thin film. That is, there arecrystal grains grown in the shape of “asteroid” and crystal grains grownin the shape of “ellipsoid” in admixture.

The crystal grains grown in the shape of ellipsoid are silicon singlecrystals and the (311) plane of silicon crystal is grown to the topsurface of the thin film. This is confirmed by an electron diffractionmethod. On the other hand, the crystal grains grown in the shape ofasteroid are polycrystalline silicon and each hand portion of theasteroid shows a single crystal state having the (111) crystal plane.This is also confirmed by the electron diffraction method.

Further, analysis reveals that in the asteroid crystal grains, each handis grown from central portion of the asteroid and the impurity such as Pconcentration near the central portion is higher than the average Pconcentration of the thin film by 30% to 50%. These results suggest thatthe nucleuses of these crystal gains seem to be formed by unevenlydistributed high P concentration. Another proof is that the crystalgrain density of the asteroid crystals do not change almost from thebeginning of crystal growth.

In the course of growth of crystal grains, asteroid crystal grains growfirst, followed by growth of elliptic crystal grains. But, the ellipticcrystal grain density seems to increase simply with the lapse of time.From this point of view, the form of crystal growth is greatly differentbetween the asteroid crystal grains and the elliptic crystal grains.Since crystal anisotropy exists in physical properties of siliconcrystals, when crystal grains having different orientations of crystalplanes are present in admixture, physical properties become differentlocally in the thin film.

The presence of such thin film in the semiconductor device is notpreferable. It is desirable that the crystal orientation is almost in auniform direction. Further, internal stress state in the thin filmchanges depending on orientation of crystal plane. The internal stressvalue is the highest when the (111) crystal plane grows and decreaseswith an increase of the crystal plane indices (the direction from the(111) plane to the (211) plane and (311) plane). Measured value ofinternal stress is 1200 MPa when the crystal plane index is at the (111)plane, 1000 MPa at the (211) plane, and 800 MPa at the (311) plane. Thisis because in the silicon crystals since the (111) crystal plane has thehighest atomic density at the highest denseness plane, the shrinkage ofthe thin film becomes larger relatively compared with the case ofgrowing other crystal plane.

When the thin film as a single body shrinks freely, no stress isgenerated. But in practice, since the silicon thin film adheres to (orsticks to) the underlying film, the thin film is restrained from freeshrinkage, resulting in generating stress in the thin film. The value ofstress generated seems to be higher with larger shrinkage of the thinfilm. Therefore, when the (111) crystal plane grows, the internal stressin the thin film seems to become the highest.

The above-mentioned internal stress value in the thin film is in thecase when a simple crystal plane grows. When crystal grains growing indifferent crystal plane directions are present in admixture, anintermediate value will be taken depending on occupying rates of crystalplane directions of individual crystal grains. In this case, it is verydifficult to control the internal stress of the thin film. Further, evenwhen the (111) crystal plane which is to take a high internal stressvalue grows, it is possible to prevent the generation of failure causedby the internal stress of whole of the semiconductor device by changinga semiconductor device structure or a combination of materials used.Thus, if the stress value to be generated is known, it is possible toavoid the case of impossible to use. The important thing is to establishthe homogenuity of the thin film (including variation of stress value)by avoiding the admixed state of crystal grains having different growncrystal planes.

When the thin film is deposited by positively controlling the impurity(e.g. phosphorus P) concentration near the interface of underlying film,the crystals grow as follows. In the case of forming a P-doped siliconthin film, the crystal growth of the silicon thin film can be controlledby positively controlling the P concentration near the interface ofunderlying layer.

By applying this thin film deposition method, it is possible to grow aspecial crystal plane. Thus, it is possible to obtain polycrystallinesilicon film having an almost uniform crystal state (i.e.polycrystalline silicon thin film having no dispersion or variation ofinternal stress) with sufficiently low electrical resistance by formingan amorphous silicon thin film by this depositing method, followed bycrystallization by heat treatment.

As mentioned above, it is important to control the crystal growth of thethin film in order to obtain the polycrystalline film having highlyhomogeneous and almost uniformly grown crystal planes. Further, even inthe case of growing the polycrystalline layer from the beginning of thedeposition of thin film, it is important to control the P concentrationfrom the beginning of the deposition of thin film from the viewpoint ofcontrol of crystal growth. Thus, this thin film deposition method isvery important from the viewpoint of controlling crystal planes ofpolycrystalline thin film.

According to the present invention, the semiconductor device using asilicon thin film doped with an impurity of group III or V elements ischaracterized in that the semiconductor device is produced bycontrolling the impurity concentration near the interface between theunderlying film and the silicon thin film to remarkably low (preferablyzero or almost zero) compared with the average impurity concentration inthe thin film, or sufficiently high; and as a result, the crystal planedirection in the polycrystalline silicon thin film after crystallizationis in an almost uniform direction.

The above-mentioned steps for forming a silicon thin film can also beapplied to processes for producing a silicon thin film on an optionalsubstrate.

The chemical vapor deposition apparatus suitable for producing such asilicon thin film according to the present invention comprises

a reaction chamber installing therein a support board for placing asubstrate such as a wafer,

a gas introducing unit for introducing a raw material gas (e.g. SiH₄ orSi₂H₆ gas) and an impurity gas (selected from group III and V elements)into the reaction chamber,

a unit for controlling film deposition in the reaction chamber, and

a gas exhaust unit for exhausting gases from the reaction chamber,

said unit for controlling film deposition being made either

(i) so as to introduce the impurity gas together with the raw materialgas after the introduction of only the raw material gas for apredetermined time, or

(ii) so as to introduce only the impurity gas for a predetermined timebefore the introduction of the raw material gas together with theimpurity gas.

The present invention is illustrated by way of the following Examples.

EXAMPLE 1

This Example shows the case of not introducing an impurity near theinterface of underlying film as a method of controlling the impurityconcentration and distribution thereof near the interface of underlyingfilm.

This Example is explained referring to FIGS. 1 to 7. This Example issuitable for producing a gate electrode of MOS(metal-oxide-semiconductor) transistor. FIG. 1 is a cross-sectional viewimmediately after the deposition of thin film (after patterning). FIG. 2is a cross-sectional view after formation of a polycrystalline film andformation of an insulating film 6. In FIGS. 1 and 2, numeral 1 denotes asilicon substrate, numeral 2 denotes a silicon oxide film, numeral 3denotes a non-doped amorphous silicon layer, numeral 4 denotes a P-dopedamorphous silicon layer, numeral 5 denotes a P-doped polycrystallinesilicon film, and numeral 30 denotes an interface of underlying film.FIGS. 3 to 6 are transmission electron microscope photographs showingcrystal growth when an amorphous silicon thin film in about 500 nm thickis doped with an impurity such as P (phosphorus) in an averageconcentration of c.a. 4×10²⁰/cm³ at near the interface of the underlyingfilm, followed by heat treatment for polycrystallization. FIGS. 3 and 5are cross-sectional views of the thin film, and FIGS. 4 and 6 aresurface views of the thin film. Further, FIGS. 5 and 6 show the case offorming a non-doped layer. FIG. 7 is a flow chart showing a process forproducing a gate electrode film.

The process for depositing a P-doped silicon thin film on a siliconsubstrate 1 on which a silicon oxide film 2 is formed is explainedreferring to FIG. 7. In the step (i), deposition of a P-doped siliconthin film begins. First, only a raw material gas (e.g. SiH₄ gas or Si₂H₆gas) is introduced for a predetermined time to deposit an amorphoussilicon film (ii). By this, the non-doped layer 3 not doped with P shownin FIG. 1 is formed (iii). After the lapse of the predetermined time, aP doping gas (e.g. PH₃ gas) is introduced (iv). Then, the deposition ofP-doped amorphous silicon film 4 is continued to a predeterminedthickness (v). In this case, the total thickness and average Pconcentration of the thin film are made equal to the case of notpositively controlling the P concentration near the interface ofunderlying film. By this, the amorphous silicon thin film shown in FIG.1 is formed (vi). After heat treatment, P-doped polycrystalline siliconfilm 5 is formed by crystallization.

The thus polycrystallized film is obtained by initially growingindividual crystal grains from near the interface of underlying film andfurther growing columnar structure to the thin film surface. This can beconfirmed by FIGS. 3 and 5 observed from the cross-sectional direction.In other words, the crystal nucleuses of individual crystal grains aregenerated near the interface of underlying film. But it should be notedthat when observed from the surface direction of the thin film, theplane shape of crystal grains is divided into two kinds as shown in FIG.4 when the non-doped layer is not formed. That is, there are crystalgrains grown in the asteroid shape and crystal grains grown in theelliptic shape in admixture. In contrast, when the non-doped layer isformed as shown in FIG. 6, crystal grains having the asteroid shape arenot admitted and only crystal grains having the elliptic shape areadmitted. The elliptic crystals have the (311) crystal plane grown tothe thin film surface. This is confirmed by the measured results byelectron diffractometry.

From these measured results, it becomes clear that it is possible toform a thin film wherein only the (311) crystal plane is grown byforming the non-doped layer which is not doped with P positively at nearthe interface of the underlying film.

On the other hand, in order to reduce the electric resistivity of thewhole thin film, it is impossible to thicken the thickness of the layernot introducing the impurity without limitation. Therefore, thethickness of the layer not doped with the impurity is as small aspossible so as to make the crystal growth mode uniform and the amount ofimpurity for doping in the upper layer of the thin film is a sufficientamount for controlling the electric resistance as a whole to apredetermined value.

It is clear from the experimental data that when the thickness of thenon-doped layer is less than 1 nm, the effect mentioned above isreduced. This is because since P-doping begins after the formation ofthe non-doped layer, P seems to diffuse into the non-doped layer duringthe deposition of the P-doped film, when the thickness of non-dopedlayer is less than 1 nm. Therefore, the growth of the special crystalplane is not dominated so as to make it difficult to control theinternal stress as in the case of known production processes. When thethickness is 1 nm or more, even if P diffuses during the P-doped thinfilm deposition, the effect is not reached to the non-doped layer nearthe interface of underlying film, resulting in not influencing thecrystal growth. Further, it is confirmed by experiments that thethickness of 10 nm or less is sufficient to show the above-mentionedeffect. When the thickness is more than 10 nm, the proportion of growthof the special crystal plane is not changed, but the electric resistanceof the silicon thin film increases undesirably. Therefore, in order toreduce the electric resistance of the silicon thin film, the thicknessof the layer not containing the impurity is preferably 1 to 10 nm. Thus,the predetermined time for depositing the amorphous film means a timenecessary for depositing the film having the film thickness in theabove-mentioned range.

On the other hand, even in the case of growing polycrystalline layerfrom the beginning of the film deposition, the crystal growth can becontrolled by controlling the P concentration at the beginning of thefilm deposition. For example, when a polycrystalline layer is formed ona silicon oxide film using a SiH₄ gas, the (311) crystal plane growspredominantly by making a time lag of introduction of P, while the (211)crystal plane grows predominantly when P is introduced positively.

The thin film having the above-mentioned structure can be formed withoutdivided two steps. In the case of forming the silicon thin film dopedwith an impurity by in-situ doping, the flow of a dopant gas can bestarted after a predetermined time from the beginning of flow of a rawmaterial gas for forming the silicon thin film. By this, it is possibleto form a silicon thin layer containing no impurity and a silicon thinlayer doped with the impurity continuously.

The impurity used as a dopant is not limited to P, and B (boron) or As(arsenic) can also be used. Therefore, the dopant gas, the dopedamorphous silicon film and the polycrystalline silicon thin film caninclude B or As in place of P. This can also be applied to the Examplesmentioned below.

In this Example, the crystallization is conducted after patterning ofamorphous silicon film (after the state shown by FIG. 1), but notlimited thereto and possible before the patterning. Further, as theimpurity, B or As can be used as a dopant in place of P. This can alsobe applied to the Examples mentioned below.

Further, the process of this Example is not limited to the production ofthe gate electrode of the MOS transistor structure, and can be appliedto the production of an emitter electrode, a base electrode and acollector electrode of bipolar transistors, or a gate electrode, afloating electrode, and a control electrode of flash memory structure.

EXAMPLE 2

This Example shows the case of controlling the impurity concentrationnear the interface of underlying film to a sufficiently high value.

This Example is explained referring to FIGS. 8 to 10. This Example alsoshows the production of gate electrode in the MOS transistor as inExample 1. FIG. 8 is a flow chart explaining the deposition steps. FIG.9 is a cross-sectional view immediately after the film deposition (afterthe film deposition and patterning), wherein numeral 7 denotes a P-highconcentration layer, and FIG. 10 is a cross-sectional view afterformation of polycrystalline film and then an insulating film 6.

In order to control the impurity concentration near the interfacebetween the underlying film and the silicon thin film at a sufficientlyhigh value, it is preferable to introduce only the impurity gas for apredetermined time before introduction of a raw material gas such asSiH₄ gas or Si₂H₆ gas for depositing the silicon thin film in order toform an impurity layer near the interface of underlying film, followedby deposition of silicon thin film doped with the impurity.

This Example is explained referring to the flow chart of FIG. 8. In thisExample, on a silicon substrate 1, on which a silicon oxide film 2 isformed, a P-doped amorphous silicon film 4 is deposited (i). First, onlyP-dopant gas is introduced immediately after the beginning (ii). Byintroducing P-dopant for a predetermined time, a P-high concentrationlayer 7 is formed (iii). Then, a raw material gas (e.g. SiH₄ gas orSi₂H₆ gas) for depositing the silicon thin film is introduced (iv). Thedeposition of P-doped amorphous silicon film 4 is continued to obtainthe predetermined thickness (v). In this case, the thickness of thewhole thin film and the average P concentration therein are made equalto the case of not positively controlling the P concentration near theinterface of the underlying film. By this, the amorphous silicon thinfilm having the structure shown in FIG. 9 is formed (vi). Aftercrystallization by heat treatment, the P-doped polycrystalline siliconfilm 5 is formed.

By employing this deposition method, a P-doped amorphous silicon film 4is formed after the formation of P-high concentration layer 7 whereinthe impurity is unevenly present near the interface of the underlyingsilicon oxide film 2. By subjecting the resulting thin film to heattreatment, there is formed a polycrystalline layer wherein the unevenlydeposited high concentration P becomes crystal nucleuses to proceedcrystal growth and the asteroid shaped crystal grains predominantly growin substantially 90% or more, so that the crystal grains grow in thedirection of the (111) crystal plane. As a result, the polycrystallinefilm after the crystallization reaction has a uniform crystal planedirection of the (111) crystal plane. Thus, the internal stress isreduced to a stable predetermined value.

The process of this Example is not limited to the production of the gateelectrode of the MOS transistor structure, and can be applied to theproduction of an emitter electrode, a base electrode and a collectorelectrode of bipolar transistors, or a gate electrode, a floatingelectrode, and a control electrode of flash memory structure.

EXAMPLE 3

This Example is explained referring to FIGS. 7, 11 and 12. In thisExample, the present invention is applied to the formation ofpolycrystalline silicon thin film forming a semiconductor device such astransistors and diodes.

FIG. 7 is a flow chart showing the steps for forming the polycrystallinesilicon thin film. FIG. 11 is a cross-sectional view showing the stateimmediately after the deposition of the thin film, and FIG. 12 is across-sectional view of the transistor formed in the polycrystallinesilicon thin film, wherein numeral 8 denotes an underlying film, numeral9 denotes an emitter electrode, numeral 10 denotes a base electrode,numeral 11 is a collector electrode, and numeral 12 is a substrate. Inthis Example, the step of introduction of impurity for forming thetransistor is omitted, since it has no direct relation to the essence ofthis Example.

In this Example, on a silicon substrate 1, an underlying film 8 madefrom a different material (e.g. SiN) from silicon is formed. On this, aP-doped silicon thin film is formed (i). First, only the raw materialgas (e.g. SiH₄ gas or Si₂H₆ gas) is introduced (ii). After apredetermined time, a non-doped amorphous silicon layer 3 having thepredetermined thickness is formed (iii). Then, an impurity of P as adopant gas is introduced (iv). The deposition of P-doped amorphoussilicon film 4 is continued to obtain the predetermined thickness (v).The thickness of the whole thin film and the average P concentrationtherein are made equal to the case of not positively controlling the Pconcentration near the interface of underlying film. FIG. 11 is across-sectional view of the thus produced thin film (vi).

In this Example, since the (311) crystal plane begins to grow already inthe initial non-doped layer, the growth of (311) crystal plane in theP-doped layer is continued to finally obtain a polycrystalline filmhaving an orientation in the (311) crystal plane direction uniformly.Further, when P is positively introduced as in Example 1, the (211)crystal plane predominantly grows. After crystallization reaction byheat treatment, the P-doped polycrystalline silicon film 5 is formed.Thereafter, a transistor is formed to give a semiconductor device havingthe cross-sectional structure as shown in FIG. 12.

In this Example, since a bipolar transistor is formed, the baseelectrode 10, the emitter electrode 9, the collector electrode 11, etc.are formed. These electrodes are not always be required to be formednearby, and the order of the positions of them can be optional. Further,the transistor formed in the polycrystalline silicon thin film is notalways limited to the bipolar transistor, and it can be a diode, orother type of transistor, and the like semiconductor device.

In this Example, since the non-doped layer is present near the interfaceof underlying film under the P-doped amorphous silicon thin film, therecan be obtained a polycrystalline layer having the orientationpredominantly (90% or more) in the direction of the (311) crystal planeor (211) crystal plane. Further, since the P-doped silicon thin filmstable in internal stress can be obtained, properties of thesemiconductor device (e.g. transistor) formed in individual crystalgrains are low in variation, and thus remarkably stabilized.

EXAMPLE 4

This Example is explained referring to FIGS. 8, 13 an 14. This Exampleis suitable for the production of polycrystalline silicon thin film inwhich a semiconductor device such as a transistor or diode is formed.FIG. 13 is a cross-sectional view immediately after the deposition ofthe thin film. FIG. 14 is a cross-sectional view of the transistorformed in the polycrystalline silicon thin film. In this Example, thestep of introduction of impurity for forming the transistor is omitted,since it has no direct relation to the essence of this Example.

This Example is explained referring to the flow chart of FIG. 8. In thisExample, on the silicon substrate 12, an underlying film 8 made from adifferent material (e.g. SiN) from silicon is formed, and a P-dopedsilicon thin film 4 is formed thereon (i). First, only a P dopant isintroduced immediately after the beginning (ii). After a predeterminedtime, a P-high concentration layer 7 is formed (iii). Then, a rawmaterial gas (e.g. SiH₄ gas or Si₂H₆ gas) is introduced for depositing asilicon thin film (iv). The deposition of P-doped amorphous silicon film4 is continued to obtain a predetermined thickness (v). In this case,the thickness of whole thin film and the average P concentration thereinare made equal to the case of not positively controlling the Pconcentration near the interface of underlying film. By this, theamorphous silicon thin film having the structure as shown in FIG. 13 isformed (vi).

By subjecting the resulting thin film to heat treatment, there is formedthe P-doped polycrystalline silicon film 5, wherein the crystal grainsgrow in the direction of the (111) crystal plane by conducting thecrystal growth using the unevenly deposited P in high concentration ascrystal nucleuses. Thus the polycrystalline thin film after thecrystallization reaction is a uniform and homogeneous film having theorientation in the (111) crystal plane direction. Further, since theP-doped silicon thin film stable in internal stress can be obtained,properties of the semiconductor device (e.g. transistor) formed inindividual crystal grains are low in variation, and thus remarkablystabilized.

FIG. 14 is a cross-sectional view of a semiconductor device forming atransistor in the polycrystalline layer. In this Example, since abipolar transistor is formed, a base electrode 10, an emitter electrode9, a collector electrode 11, etc. are formed. These electrodes are notalways required to be formed nearby, and the order of the positions ofthem can be optional. Further, the transistor formed in thepolycrystalline silicon thin film is not always limited to the bipolartransistor, and it can be a diode, or other type of transistor, and thelike semiconductor device. Further, it is possible to use B or As as adopant in place of P.

EXAMPLE 5

This Example is explained referring to FIGS. 7 and 15. FIG. 15 is across-sectional view of a gate electrode in a MOS transistor obtainedfrom the polycrystalline silicon thin film deposited according to thepresent invention.

In this Example, a P-doped silicon thin film is deposited using a SiH₄gas on a silicon oxide film 2 formed on a silicon substrate 1 (i).First, only the raw material gas (SiH₄ gas) is introduced for depositinga silicon thin film (ii). After a predetermined time, a non-dopedamorphous silicon layer 3 having a predetermined thickness is formed. Bythis, the film having an orientation in the (311) crystal planedirection is formed (iii). Then, a dopant P gas is introduced (iv).Then, a P-doped amorphous silicon film 4 is deposited continuously toobtain a predetermined thickness (v). In this case, the thickness ofwhole thin film and P concentration therein are made equal to the caseof not positively controlling the P concentration near the interface ofunderlying film (vi). Subsequently, the heat treatment forcrystallization is carried out to form the P-doped polycrystallinesilicon film 5. By this, there is formed the polycrystalline layerhaving the structure shown in FIG. 15.

In this Example, since the (311) crystal plane begins to grow already inthe initial non-doped layer, the growth of (311) crystal plane in theP-doped layer is continued to finally obtain a homogeneouspolycrystalline film having an orientation in the (311) crystal planedirection. Since the thin film is homogeneous, the thin film isstabilized by controlling the internal stress. Further, it is possibleto use B or As as a dopant in place of P.

EXAMPLE 6

This Example is explained referring to FIGS. 8 and 15. FIG. 15 is across-sectional view of a gate electrode in a MOS transistor obtainedfrom the polycrystalline silicon thin film deposited according to thepresent invention.

As shown in FIG. 8, in this Example, a P-doped silicon thin film isdeposited using a SiH₄ gas on a silicon oxide film 2 formed on a siliconsubstrate (i). First, only a P-dopant gas is introduced immediate afterthe beginning (ii). After a predetermined time, a P-high concentrationlayer 7 is formed (iii). Then, a raw material gas (SiH₄ gas) isintroduced for depositing a silicon thin film (iv). The deposition ofP-doped amorphous silicon film 4 is continued to obtain a predeterminedthickness (v). In this case, the thickness of whole thin film and theaverage P concentration therein are made equal to the case of notpositively controlling the P concentration near the interface ofunderlying film.

By employing this depositing method, there is formed the polycrystallinesilicon thin film wherein the layer containing P in high concentrationand unevenly is formed near the interface of the underlying siliconoxide film 2. By proceeding the crystal growth using the highconcentration and unevenly present P as the crystal nucleuses, crystalgrains having an orientation in the direction of (211) crystal planegrow. Thus, the P-doped polycrystallize silicon film 5 shown in FIG. 5after the completion of crystallization becomes a homogeneous filmhaving the (211) crystal plane uniformly at the thin film surface andshowing a stabilized internal stress value.

In this Example, it is possible to use B or As as a dopant in place ofP.

EXAMPLE 7

This Example is explained referring to FIGS. 8 and 12. In this Example,a polycrystalline silicon thin film is deposited, followed by formationof a transistor in the polycrystalline silicon thin film. FIG. 12 is across-sectional view of a semiconductor device in which a transistor isformed in the polycrystalline layer. FIG. 8 is a flow chart showing thesteps for forming the polycrystalline silicon thin film. Further, sincethe step of introducing an impurity has no direct relation to theformation of the transistor, it is omitted.

As shown in FIG. 8, in this Example, a P-doped silicon thin film isformed on the silicon oxide film 2 formed on the substrate 12 made froma different material from the silicon substrate 1(i). First, only a Pdopant gas is introduced immediately after the beginning (ii). After apredetermined time, a P-high concentration layer 7 is formed (iii).Then, a raw material gas (SiH₄ gas) is introduced for the deposition ofsilicon thin film (iv). The deposition of P-doped amorphous silicon film4 is continued to obtain a predetermined thickness (v). In this case,the thickness of whole thin film and the average P concentration thereinare made equal to the case of not positively controlling the Pconcentration near the interface of underlying film. By employing thisdepositing method, there is formed the polycrystalline silicon thin filmwherein after the formation of the layer containing P in highconcentration near the interface of the silicon oxide film 2, theP-doped polycrystalline silicon film 5 is formed.

By proceeding the crystal growth using the P deposited in highconcentration as crystal nucleuses, the crystal grains grow in thedirection of (211) crystal plane. Thus, the polycrystalline film aftercrystallization reaction becomes a homogeneous film having anorientation in the direction of (211) crystal plane uniformly andshowing a stabilized internal stress value. In this Example, it is alsopossible to use B or As as a dopant in place of P.

In this Example, since a bipolar transistor is formed, a base electrode10, an emitter electrode 9, a collector electrode 11, etc. are formed.These electrodes are not always required to be formed nearby, and theorder of the positions of them can be optional. Further, the transistorformed in the polycrystalline silicon thin film is not always limited tothe bipolar transistor, and it can be a diode, or other type oftransistor, and the like semiconductor device.

In this Example, since the non-doped layer is present near the interfaceof underlying film under the P-doped amorphous silicon thin film, the(211) crystal plane predominantly grows at the time of crystallizationreaction by heat treatment to give a homogeneous polycrystalline layer.Further, since the P-doped silicon thin film having a stabilizedinternal stress values is obtained, properties of semiconductor device(e.g. transistor) formed in individual crystal grains are low indeviation and thus stabilized.

EXAMPLE 8

This Example is explained referring to FIG. 16. In this Example, thepresent invention is applied to a flash memory. FIG. 16 is across-sectional view of a flash memory, wherein numeral 27 denotes afloating electrode, and numeral 28 denotes a polycrystalline siliconthermal oxidation film. The flash memory comprises a silicon substrate1, a silicon oxide film 2 (a ultrathin oxidized film) formed thereon, aP-doped polycrystalline silicon film 5 formed on the silicon oxide film,a polycrystalline silicon thermal oxidation film 28 formed by thermaloxidation of the surface of the polycrystalline silicon thin film, andan electroconductive thin film 27 which is to become a floatingelectrode formed on the polycrystalline silicon thermal oxidation film28.

The P-doped polycrystalline silicon film 5 can be produced either byproducing the non-doped layer near the interface of underlying oxidefilm as described in Example 1, or by producing the P-high concentrationdoper layer as described in Example 2. In either case, the resultingP-doped polycrystalline silicon film has an orientation in an almostuniform direction as explained previously.

In the case of forming the silicon oxidation film 28 by thermaloxidation of the surface of the P-doped polycrystalline silicon thinfilm 5, since the polycrystalline thin film has an almost uniformdirection of crystal plane, the thickness of the thermal oxidation filmgrown on individual grains becomes uniform. This is a result of losingan influence of the anisotropy wherein the growth speed of oxidationfilm is different in crystal plane directions, in the case of thermaloxidation of silicon crystals. Thus, it is possible to obtain theuniform film thickness.

In this Example, only the thermal oxidation film 28 is formed betweenthe P-doped polycrystalline silicon film 5 and the floating electrode27, but in order to enhance a dielectric constant, it is possible toform a silicon nitride film or a laminate of a silicon nitride film anda silicon oxide film between the thermal oxidation film 28 and thefloating electrode 27. It is also possible to use B or As as a dopant inplace of P.

In this Example, since the film thickness of the thermal oxidation filmcan be formed uniformly locally (in the unit of each crystal grain)between the P-doped polycrystalline silicon film 5 and the floatingelectrode 28, it is possible to control the variation of pressureresistance caused by variation in the oxidation film thickness and todesign the thickness of the oxidation film as thin as possible.

EXAMPLE 9

This Example is explained referring to FIGS. 7, 8 and 17. This Exampleshows a structure of apparatus for depositing the thin film realizingthe thin film deposited structure and deposition process of the presentinvention. FIG. 17 is a schematic view of a chemical vapor deposition(CVD) apparatus, wherein numeral 20 denotes a reaction chamber fordepositing the thin film, numeral 21 denotes a gas introducing unit,numeral 22 denotes a gas flow control valve, numeral 23 denotes a gasbomb for depositing a silicon thin film, numeral 24 denotes a gas bombfor introducing an impurity element, numeral 25 denotes a filmdeposition control unit in the reaction chamber, numeral 26 denotes agas exhaust unit, numeral 31 is a wafer and numeral 32 is a board. InFIG. 17, an upright type CVD apparatus is shown (a heater is not shownin the drawing), but it is possible to use a lateral type CVD apparatusor a sheet treating type.

In the reaction chamber 20, the wafer 31 is placed on the board 32. Thefilm deposition control unit 25 is to control the temperature in thereaction chamber, and to control transport of a substrate on which thethin film is to be deposited. The gas bomb 23 is used for storing theraw material gas (e.g. SiH₄ gas or Si₂H₆ gas) for depositing the siliconthin film. The gas bomb 24 is used for storing the impurity gas as adopant such as P, B, As, etc.

The gas introducing unit 21 controls the timing of introducing each gasinto the reaction chamber 20 and the timing of opening or closing thegas flow control valve 22 for depositing the P-doped silicon thin filmaccording to the process shown in FIG. 7 or FIG. 8.

In FIG. 17, each one path for introducing the raw material gas and theimpurity gas is shown, but it is possible to use a plurality of pipesfor introducing these gases into the reaction chamber 20. In eithercase, the gas introduction paths and gas introduction timing should becontrolled by the gas introducing unit 21. In this apparatus, theimpurity-doped silicon thin film can be either an amorphous siliconlayer or a polycrystalline silicon layer.

By using the apparatus shown in FIG. 17, it is possible to form thenon-doped layer or the impurity-high concentration layer can be formednear the interface of the underlying film. Thus, it becomes possible tocontrol the crystal orientation of the polycrystalline silicon thinfilm, resulting in obtaining the homogeneous silicon thin film having astabilized internal stress value in a high yield with stably.

In the above Examples, the crystal orientation of (311) plane, (211)plane or (111) plane is illustrated but not limited thereto. The crystalplane can also include the (100) plane, (110) plane, and the like.

As mentioned above, the polycrystalline silicon thin film and thesemiconductor device using the silicon thin crystal can be controlled tohave an almost uniform crystal plane direction, thus the homogeneouspolycrystalline silicon thin film having a stabilized internal stressvalue can be produced stably in a high yield.

What is claimed is:
 1. A process for producing a semiconductor device,which comprises forming an underlying film on a semiconductor substrate,and forming a silicon thin film on the underlying film by depositing asilicon film having no impurity from a SiH₄ gas or a Si₂H₆ gas to athickness of 1 nm or more, followed by deposition of the silicon filmdoped with an impurity selected from group III and V elements.
 2. Aprocess according to claim 1, wherein the impurity gas is not introduceduntil the film thickness of silicon thin film becomes 1 to 10 nm.
 3. Aprocess according to claim 1, wherein said deposition of the siliconfilm doped with the impurity is performed using a raw material gas, fordepositing the silicon film, and an impurity gas for depositing saidimpurity.
 4. A process according to claim 1, wherein in said depositionof the silicon film doped with the impurity the silicon film andimpurity are simultaneously deposited.
 5. A process for producing asemiconductor device, which comprises forming an underlying film on asemiconductor substrate, and forming an amorphous silicon thin film onthe underlying film by depositing a silicon film having no impurity froma SiH₄ gas or a Si₂H₆ gas to a thickness of 1 nm or more, followed bydeposition of the silicon film doped with an impurity selected fromgroup III and V elements, and heat treating the amorphous silicon thinfilm to give a polycrystalline silicon thin film.
 6. A process accordingto claim 5, wherein said deposition of the silicon film doped with theimpurity is performed using a raw material gas, for depositing thesilicon film, and an impurity gas for depositing said impurity.
 7. Aprocess according to claim 5, wherein in said deposition of the siliconfilm doped with the impurity the silicon film and impurity aresimultaneously deposited.
 8. A process for producing a silicon thinfilm, which comprises introducing into a reaction chamber a raw materialgas selected from SiH₄ gas and Si₂H₆ gas to deposit a silicon filmhaving no impurity to a thickness of 1 nm or more, followed byintroduction of an impurity gas selected from group III and V elementstogether with the raw material gas to deposit a silicon film doped withthe impurity.
 9. A process according to claim 8, wherein the impuritygas is not introduced into the reaction chamber until the film thicknessof silicon thin film becomes 1 to 10 nm.
 10. A process for producing asilicon thin film, which comprises introducing into a reaction chamber araw material gas selected from SiH₄ gas and Si₂H₆ gas to deposit anamorphous silicon film having no impurity to a thickness of 1 nm ormore, followed by introduction of an impurity gas selected from groupIII and V elements together with the raw material gas to deposit anamorphous silicon film doped with the impurity, and heat treating theamorphous silicon thin film to finally provide a polycrystalline siliconthin film.